Mingyi silicone（anhui）co,.ltd
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Core Specifications
Chemical Identity: C₁₂H₁₂O₂Si (MW: 216.31), CAS 947-42-2
Purity: >98.0% (incl. dimer content, HPLC-verified)
Form: White needle-shaped crystals (20°C)
Melting Point: 118–120°C (sharp phase transition)
Bulk Density: ≈0.41 g/cm³ (20°C)
Flash Point: 167°C (closed cup)
Trace Impurities: Halogens <5 ppm, PCBs & PAHs None Detected (GC-MS)
1. Electronic-Grade Purity
98% active content ensures predictable reaction kinetics, eliminating side products in:
Semiconductor Encapsulants: Synthesize phenyl-modified silicones for –60°C to 250°C thermal stability
Optical Polymers: Build LED encapsulants with RI >1.55 and >92% light transmission
2. Sub-ppm Impurity Assurance
Halogens <5 ppm: Prevents electrochemical migration in IC packaging
Zero PCBs/PAHs: Meets USP Class VI requirements for biomedical applications
3. Engineered Crystal Morphology
Needle structure enables ±0.5% dosing accuracy in solid-phase reactions
Low bulk density (0.41 g/cm³) accelerates solvent dispersion, reducing induction time by 25–30%
| Industry | Function | Performance Gain |
|---|---|---|
| Silicone Resins | Phenyl group incorporation | ↑ Thermal stability (Tg >200°C), ↑ UV resistance |
| Pharmaceuticals | Si–C drug scaffold synthesis | ↑ Metabolic stability of API candidates |
| Electronics Adhesives | Organic-inorganic interface modifier | ↑ Adhesion strength (≥3.5 MPa) on SiO₂ substrates |
| Composite Materials | Surface energy mediator for CF/EP interfaces | ↓ Phase separation, ↑ tensile modulus |
A. Batch-to-Batch Consistency
Melting point variance ≤1°C (vs. industry standard ≤3°C)
Crystallinity controlled via directional solidification technology
B. Full Traceability
Raw Si source to final product tracked by MS/GC fingerprints
ISO 9001-compliant manufacturing audit trail
C. Regulatory Readiness
REACH registered, TSCA compliant
Halogen data package for IEC 61249-2-21 compliance
